Products
MEMS Ultrasonic Sensor
Product model: PU0003
The PU0003-000 is a surface-mountable ultrasonic Time-of-Flight (ToF) sensor designed for direct PCB reflow soldering, eliminating the need for manual or standalone mechanical mounting. It is primarily engineered for surface material classification (distinguishing between hard and soft surfaces) and cliff/drop detection, while also excelling at short-range distance measurement spanning $2\text{ to }30\text{ cm}$.For material detection (e.g., tile vs. carpet), the sensor operates with high accuracy within a $2\text{ to }6\text{ cm}$ range. Ultrasonic signals emitted by the sensor bounce back upon striking hard surfaces, generating a clear echo. Conversely, soft materials fully or partially absorb the ultrasonic signal. By analyzing the presence and amplitude of the returning signal, the sensor reliably classifies surface materials within the target range.Ideal applications include smart home appliances, robotic cleaning systems, and consumer electronics.
Product Features
- MEMS ultrasonic sensor with a resonance frequency of 450 kHz, featuring a high frequency that results in an extremely short wavelength (approximately 3.3 mm in water), enabling easier focusing of the sound beam.
- 1. SMT-compatible design for direct reflow soldering onto PCBs, eliminating the need for manual secondary soldering;
- 2. Ultra-compact footprint, versatile across diverse application scenarios;
- 3. High sensitivity for superior detection accuracy and performance;
- 4. Highly resistant to ambient light interference, ensuring exceptional operational stability.
Product Specifications
Dimensions(mm)
Specifications
Parameter | Condition / Description | Min. | Typ. | Max. | Unit |
Blind‑zone Time | Transmit‑Receive ¹ | 110 | 120 | 150 | us |
Resonant Frequency f₀ | 440 | 450 | 460 | kHz | |
Drive Voltage | 3 | 5 | 20 | V | |
Capacitance | 0.58 | 0.66 | 0.74 | nF | |
Operating Temperature | -20 | 25 | 70 | °C | |
Storage Temperature | -40 | 25 | 80 | °C | |
RoHS | YES | ||||
¹ Blind‑zone performance depends on structural design such as horn housing. | |||||
Applications
- Detection of defects in electronic component packaging
- Detection of delamination in composite materials
- High-frequency ultrasound microscopy in biomedical applications (skin, ophthalmology, small animal research, etc.)
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